Et est admodum mirum videre plebem innumeram mentibus ardore quodam infuso cum dimicationum curulium eventu pendentem. haec similiaque memorabile nihil vel serium agi Romae permittunt. ergo redeundum ad textum.
Both Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) are popular surface finishes for printed circuit boards (PCBs) in high-reliability applications, including medical equipment. The choice between them often comes down to balancing cost, required reliability, and specific assembly needs.
In a high-reliability field like medical electronics, the risk of "black pad" (brittle, weak solder joints due to nickel corrosion) is unacceptable. ENEPIG's palladium layer completely mitigates this known ENIG vulnerability.
ENEPIG's layered structure, especially with the palladium barrier, provides stronger and more stable solder joints, which is crucial for devices that may undergo multiple thermal cycles or operate in dynamic environments.
Many advanced medical devices and sensors require wire bonding (connecting ultra-fine wires to the circuit board). ENEPIG offers superior wire bonding capability compared to ENIG.
| Item Name | Lorem Ipsum |
| Size (DxL) | 4mm x 40mm |
| Process | CNC Milling |
| Material | Titanium Grade 2/5 |
| Finish | Electropolishing |
| Tolerances | +/-0.005mm |
| Certificate | ISO 9001:2015 | ISO 13485 | AS9100D |
Eodem tempore Serenianus ex duce, cuius ignavia populatam in Phoenice Celsen ante rettulimus, pulsatae maiestatis imperii reus iure postulatus ac lege, incertum qua potuit suffragatione absolvi, aperte convictus familiarem suum cum pileo, quo caput operiebat, incantato vetitis artibus ad templum misisse fatidicum, quaeritatum expresse an ei firmum portenderetur.
Per hoc minui studium suum existimans Paulus, ut erat in conplicandis negotiis artifex dirus, unde ei Catenae inditum est cognomentum
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