
High-Density Interconnect (HDI) PCBs are advanced circuit boards with a higher wiring density per unit area than conventional PCBs. They achieve this through the use of advanced features like microvias, blind vias, buried vias, finer lines, and tighter spacing. HDI technology is essential for creating smaller, lighter, and more powerful electronic devices such as smartphones, tablets, and medical equipment.
| Specifications | PCB Capabilities |
|---|---|
| PCB Layers | 4 ~34 layers |
| High-Density Layers | Up to 18 layers |
| Delivery Time | 1 day to 3 weeks |
| Stackup | 1+N+1, 2+N+2, 3+N+3, 4+N+4 |
| PCB Via | Blind via, Buried via, Staggered via, Stacked via, Skip via |
| Minimum Laser Drill Diameter | 0.075mm |
| Final PCB Thickness | 0.15mm |
| Minimum Trace Width/Space | Flex/rigid-flex PCBs: 1.6mil/1.6mil |
| Rigid PCBs | 3mil/3mil |
| Production Capability | 3000m² per day |
| Copper Thickness | 100μm to 125μm |
| Impedance Control | 90Ω ~100Ω |
| Technical Feature | 90Ω & 100Ω Differential impedance, thick cooper |
| Silkscreen | White, Black, Red,etc. |
| Soldermask | Green, Blue, Purple, White, Black, Pink,Orange |






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